| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide lead frame package structure effectively improving the quality of a chip package. <P>SOLUTION: This lead frame package structure includes: a plurality of leads consisting a plurality of inner leads and a plurality of outer leads; a plurality of chips installed on a portion of the plurality of inner leads; a plurality of conductive wires electrically connecting the chips to the other inner leads; a support element installed on the lower surface of the inner leads and having a recessed tank with an opening of the recessed tank directed upward; and a molding material covering the leads, chips, conductive wires and support element, and filling up the recessed tank with a portion of the outer leads and a portion of the surface of the support member exposed. The invention also includes a method for manufacturing the lead frame package structure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
