Method of making a MEMS die having a MEMS device on a suspended structure

摘要

A microelectromechanical systems (MEMS) die includes a substrate having a first substrate layer, a second substrate layer, and an insulator layer interposed between the first and second substrate layers. A structure is formed in the first substrate layer and includes a platform upon which a MEMS device resides. Fabrication methodology entails forming the MEMS device on a front side of the first substrate layer of the substrate, forming openings extending through the second substrate layer from a back side of the second substrate layer to the insulator layer, and forming a trench in the first substrate layer extending from the front side to the insulator layer. The trench is laterally offset from the openings. The trench surrounds the MEMS device to produce the structure in the first substrate layer on which the MEMS device resides. The insulator layer is removed underlying the structure to suspend the structure.

主权项

1. A method of making a microelectromechanical systems (MEMS) die comprising:
forming a MEMS device on a substrate, said substrate having a first substrate layer, a second substrate layer and an insulator layer interposed between said first and second substrate layers, and said MEMS device being formed on a front side said first substrate layer; forming openings extending through said second substrate layer from a back side of said second substrate layer to said insulator layer; forming a trench in said first substrate layer extending from said front side to said insulator layer, said trench surrounding said MEMS device to produce a structure in said first substrate layer on which said MEMS device resides; and removing said insulator layer underlying said structure to suspend said structure.