| 发明名称 |
TRANSPARENT CONDUCTIVE MULTILAYER ASSEMBLY |
| 摘要 |
A transparent multilayer assembly, including a transparent organic polymeric flexible substrate, a transparent conductive layer on the first major surface of the substrate and an antireflective layer on the second major surface of the substrate. |
| 申请公布号 |
US2016303838(A1) |
申请公布日期 |
2016.10.20 |
| 申请号 |
US201415102866 |
申请日期 |
2014.12.08 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
Chen Wan-Chun;Chiu Chun-Ming;Luo Hui;Wang Tze Yuan;Yu Ta-Hua |
| 分类号 |
B32B27/36;C23C14/18;B32B27/06;C23C14/08;G06F3/041;B32B7/12 |
主分类号 |
B32B27/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A transparent multilayer assembly, comprising:
a transparent organic polymeric flexible substrate having first and second, opposed major surfaces; a transparent conductive layer having first and second, opposed major surfaces with the first major surface of the transparent conductive layer being disposed on, and in direct contact with, the first major surface of the substrate, and, an antireflective layer having first and second, opposed major surfaces with the first major surface of the antireflective layer being disposed on, and in direct contact with, the second major surface of the transparent organic polymeric flexible substrate. |
| 地址 |
Saint Paul MN US |
