发明名称 Electronic device with waterproof enclosure
摘要 An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure.
申请公布号 US9485891(B2) 申请公布日期 2016.11.01
申请号 US201414522223 申请日期 2014.10.23
申请人 ABB Technology Oy 发明人 Huesgen Till;Schrödl Christoph;Kearney Daniel;Riedel Gernot;Sukanen Jarmo;Tuomola Juha;Suomela Kalle;Kasza Krzysztof;Malinowski Lukasz;Matysiak Lukasz;Nupponen Mikko;Drofenik Uwe
分类号 H05K7/20;H05K5/00 主分类号 H05K7/20
代理机构 Taft Stettinius & Hollister LLP 代理人 Taft Stettinius & Hollister LLP
主权项 1. An electronic device comprising: a sealed enclosure; electronic components arranged inside the sealed enclosure and including one or more high-loss high-temperature components; a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure; a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure, wherein the air-to-air heat exchanger comprises: an auxiliary heat sink; andan internal heat sink, a base plate of the auxiliary heat sink and a base plate of the internal heat sink being connected to each other.
地址 Helsinki FI