| 摘要 |
PURPOSE:To eliminate a connecting defect at the time of repairing by connecting by a bump higher than a bump which is initially mounted in the case of repairing. CONSTITUTION:A method for connecting a circuit board 2 to connect a semiconductor chip 1 to the board 2 through a bump comprises the step of connecting by a bump 4 higher than a bump 3 which is initially mounted in the case of repairing. For example, the chip 1 in which a bump 3 having a height of 5mum is initially mounted is sucked by a tool 5 of a flip chip bonder, moved to a pad 6 of the board 2 disposed at a predetermined position, and the chip 1 is connected to the board 2 by heating, pressurizing. In this case, if a connecting defect is repaired, the bump 3 is melted by heating, and the chip 1 is removed. Then, a semiconductor chip 1a attached with the bump 4 of a height of 50mum is sucked by the tool 5, moved to a peeled part, and a desirable connection is obtained by heating, pressurizing. |
