| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die bonder capable of mounting two electronic components while keeping the relative position thereof through a simple arrangement. <P>SOLUTION: An optical pickup device comprises an optical system consisting of an objective lens, a mirror and a lens for condensing laser light at an object, and a base 3 for mounting a semiconductor laser chip 1 irradiating laser light, and a photodetector chip 2 for receiving the laser light. Surfaces 10a and 10b for mounting the semiconductor laser chip 1 and the photodetector chip 2, respectively, are provided on the base 3 of the optical pickup device, and protrusions 11 and 12 are provided in the vicinity of respective chip mounting surfaces 10a and 10b by previously setting the relative position of the semiconductor laser chip 1 and the photodetector chip 2. These semiconductor laser chip 1 and the photodetector chip 2 are abutted against the protrusions 11 and 12, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
