EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR APPARATUS OBTAINED USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing optical semiconductor elements exhibiting excellent crack resistance on solder reflowing, not to mention good transparency.

SOLUTION: The epoxy resin composition for sealing optical semiconductor elements for transfer molding comprises components (A) to (C) below and presents a solid state at room temperature. (A) A solid epoxy resin having a softening point of 50°C or higher. (B) A liquid epoxy resin which is liquid at room temperature. (C) A curing agent.

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