| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for a surface mount crystal device that prevents solder from cracking caused by a difference in coefficient of thermal expansion between a container main body and a set substrate. SOLUTION: In the mounting method for the surface mount crystal device that connects at least a pair of mount electrodes 5 provided to an external bottom surface of the container main body 3 containing a crystal piece 2 to circuit terminals 8 provided on the surface of the set substrate 7 with solder 9, a recessed portion 11 is provided on the surface of the set substrate 7 between the circuit terminals 8 corresponding to the pair of mount electrodes 5. COPYRIGHT: (C)2009,JPO&INPIT
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