| 摘要 |
PROBLEM TO BE SOLVED: To obtain a tool for flow soldering without any connection failure and any bridge failure or the like caused by a poor wetting by certainly carrying out a solder bonding of a lead terminal and a printed wiring board. SOLUTION: The tool 1 for flow soldering is for soldering with an electronic part 4 mounted on a printed wiring board 2, and has a placing part 100 which the printed wiring board 2 is placed on and has an opening 103 in a place corresponding to an insertion portion of the electronic part 4, and a side surface of the opening 103 consists of a taper surface 103a whose opening becomes larger from a placing surface 100a of the placing part 100 toward a lower part of the placing part 100. COPYRIGHT: (C)2009,JPO&INPIT
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