| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor defect analyzing apparatus which can reliably and efficiently analyze a defect in a semiconductor device using a defect observation image, a defect analyzing method, and a defect analyzing program therefore. SOLUTION: A defect analyzing apparatus 10 comprises an inspection information acquirer 11 for acquiring a defect observation image P2 in a semiconductor device, a layout information acquirer 12 for acquiring layout information, and a defect analyzer 13 for analyzing a defect. The defect analyzer 13 refers to the defect observation image, sets an analysis region in response to reaction information of the defect observation image, extracts one of a plurality of wiring lines passed through the analysis region included in the layout of the semiconductor device as a defect wiring line candidate at the same time refers to distance between the other wiring lines of the plurality of wiring lines and the wiring line candidate, and acquires proximity wiring line information for the wiring line candidate. COPYRIGHT: (C)2009,JPO&INPIT
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