| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspecting method of a semiconductor substrate which can sense efficiently mechanical damages which may be generated on the back-ground surface of the semiconductor substrate (its rear surface, i.e., its surface having no electronic circuit) by back-grinding processing to the rear surface of the semiconductor substrate whereon semiconductor elements are formed, in forming the semiconductor elements by using a largely scaled semiconductor substrate. SOLUTION: In the inspecting method of a semiconductor substrate, the semiconductor substrate is fastened onto an insulating material with a plurality of electrodes formed on the surface thereof so that the peripheral edge portions of a principal surface of the semiconductor substrate are brought into contact with the plurality of electrodes, and the value of the resistance interposed between the plurality of electrodes is measured. COPYRIGHT: (C)2009,JPO&INPIT
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