| 摘要 |
PROBLEM TO BE SOLVED: To assure a temperature difference between the surface temperature of the soldering surface of a substrate and the surface temperature of the non-soldering surface of the substrate when reflow soldering is performed on one side of the surface. SOLUTION: A heating section 15 and a housing section 35 are provided through a conveyance way 41. The heating section 15 heats the reflow surface W1 of an article W to be heated. The housing section 35 has an open surface 36 in close proximity to the conveyance way 41, and a closed surface 37 facing the open surface 36. Since a distance from the conveyance way 41 to the closed surface 37 of the housing section 35 is longer than that from the conveyance way 41 to a radiation panel 19, the temperature of the housing section 35 can be made lower than that of the heating section 15. COPYRIGHT: (C)2009,JPO&INPIT
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