TESTING THE QUALITY OF LIFT-OFF PROCESSES IN WAFER FABRICATION

摘要

Test methods and components are disclosed for testing the quality of lift-off processes in wafer fabrication. A wafer is populated with one or more test components along with the functional components. These test components are fabricated with holes in an insulation layer that is deposited between conductive layers, where the holes were created by the same or similar lift-off process that is used to fabricate the functional components on the wafer. The test components may then be measured in order to determine the quality of the holes created by the lift-off process. The quality of the lift-off process used to fabricate the functional components may then be determined based on the quality of the holes in the test components.