| 摘要 |
The present invention provides a wafer processing tape capable of reducing label stains and also reducing air flowing into a gap between an adhesive layer and an adhesive film. The present invention includes: a long release film (11); an adhesive layer (12) having a predetermined plane shape and formed on a first surface of the release film (11); a label part (13a) covering the adhesive layer (12), installed to touch the release film (11) around the adhesive layer (12), and having a predetermined plane shape; an adhesive film (13) including a neighboring part (13b) surrounding the outer part of the label part (13a); and a support member (14) placed on a second surface opposite to the first surface of the release film (11), installed in an end part in a short direction of the release film (12), and installed in an area corresponding to an area of the first surface hung on the area of the label part (13a) touching the release film (12). |
