| 摘要 |
In a semiconductor device including semiconductor modules, it is possible to average the temperatures of the semiconductor modules. At least two semiconductor modules, wherein a plurality of semiconductor circuits, on which are mounted one or more semiconductor chips having a gate terminal and gate resistors connected to the gate terminals, are disposed in parallel, are disposed above a cooling body so that an array direction of the semiconductor circuits is a direction intersecting a refrigerant flow. At least one temperature detecting resistor is disposed in each semiconductor module, a gate signal is supplied to a gate signal input terminal of one semiconductor module of the at least two semiconductor modules via the temperature detecting resistor of the other semiconductor module, and a gate signal is supplied to a gate signal input terminal of the other semiconductor module via the temperature detecting resistor of the one semiconductor module. |
