| 摘要 |
PROBLEM TO BE SOLVED: To provide a modular multi-level power conversion device, which uses a pressure-welding type semiconductor devices of an element parallel structure, with a suppressed cubic volume.SOLUTION: A plurality of IGBT stacks having a plurality of pressure-welding type semiconductor devices, metal plates and dielectric plates which are integrally pressure-welded are disposed in parallel in flush. By the electric connection of the pressure-welding type semiconductor devices constituting between the different IGBT stacks, a plurality of unit power converters having pressure-welding type semiconductor devices in parallel connection are configured. Further, by the cascade connection of each unit power converter, a plurality of unit power converters of the modular multi-level power conversion devices are configured in the plurality of IGBT stacks.SELECTED DRAWING: Figure 5 |
