发明名称 METHOD FOR PRODUCING SOLDERED ELECTRODE AND USE OF THE SAME
摘要 SOLUTION: A method for producing a soldered electrode is provided, which includes: a step (1) for forming a coating film of a photosensitive resin composition on a substrate having an electrode pad; a step (2) for forming a resist having an opening in a region corresponding to the electrode pad by selectively exposing the coating film and developing the film; a step (3) for heating and/or exposing the resist; and a step (4) for filling the opening with a molten solder while heating.EFFECT: The method for producing a soldered electrode of the present invention can prevent cracking on a resist surface even when the resist is exposed to high heat during solder filling such as in an IMS (injection molded solder) process, and which can improve solder filling performance. Thus, a soldered electrode that suits an intended purpose can be accurately produced.SELECTED DRAWING: Figure 1
申请公布号 JP2016208001(A) 申请公布日期 2016.12.08
申请号 JP20150235564 申请日期 2015.12.02
申请人 JSR CORP 发明人 TAKEKAWA JUN;TAKAHASHI SEIICHIRO;HASEGAWA KOICHI;KUSUMOTO SHIRO
分类号 H01L21/60;G03F7/40;H05K3/34 主分类号 H01L21/60
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