发明名称 Induction plasma source
摘要 An induction plasma source for integrated circuit fabrication includes a hemispherically shaped induction coil in an expanding spiral pattern about the vacuum chamber containing a semiconductor wafer supported by a platen. The windings of the induction coil follow the contour of a hemispherically shaped quartz bell jar, which holds the vacuum. The power source is a low frequency rf source having a frequency of about 450 KHz and a power in the range of 200-2000 watts, and the pressure is a low pressure of about 0.1-100 mTorr. A high frequency rf source independently adjusts the bias voltage on the wafer.
申请公布号 US5405480(A) 申请公布日期 1995.04.11
申请号 US19940273574 申请日期 1994.07.11
申请人 NOVELLUS SYSTEMS, INC. 发明人 BENZING, JEFFREY C.;BROADBENT, ELIOT K.;ROUGH, J. KIRKWOOD H.
分类号 C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H05H1/46;(IPC1-7):H01L21/00 主分类号 C23F4/00
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