发明名称 |
Method for coupling substrates and structure |
摘要 |
<p>A method for connecting substrates includes using an adhesive interposer structure (11) to bond a semiconductor device (26) to a substrate (18). The adhesive interposer structure (11) includes a non-conductive adhesive laminant (12) and conductive adhesive bumps (13). The conductive adhesive bumps (13) provide a conductive path between conductive bumps (27) on the semiconductor device (26) and conductive metal pads (21) located on the substrate (18). In an alternative embodiment, a conductive adhesive material (34) is screen or stencil printed into vias (39) located on a printed circuit board (38) to form conductive adhesive bumps (33). A non-conductive adhesive (52) is then screen or stencil printed onto the printed circuit board (38) adjacent the conductive adhesive bumps (33). A semiconductor die is then connected to the structure. <IMAGE></p> |
申请公布号 |
EP0810649(A2) |
申请公布日期 |
1997.12.03 |
申请号 |
EP19970107710 |
申请日期 |
1997.05.12 |
申请人 |
MOTOROLA, INC. |
发明人 |
GRUPEN-SHEMANSKY;LIN, JONG-KAI;TESSIER, THEODORE G. |
分类号 |
H05K1/18;H01L21/60;H01L23/485;H01L23/498;H05K1/14;H05K3/36;(IPC1-7):H01L21/60 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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