SOLVENT FOR CLEANING SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

Disclosed is a cleaning solvent, in particular a cleaning solvent for removing remaining resin compositions. This cleaning solvent contains at least an alcohol solvent having a boiling point of not less than 100°C. The alcohol solvent having a boiling point of not less than 100°C is preferably composed of at least one solvent selected from n-butyl alcohols, isobutyl alcohols, n-pentanols, 4-methyl-2-pentanol and 2-octanols. It is more preferably that the alcohol solvent is an isobutyl alcohol.