| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent the occurrence of connection failures or the like in a manufacturing device of a printed circuit board. SOLUTION: The manufacturing device of the printed circuit board solders a packaged component 2 on a printed wiring board 1. The printed circuit board is constituted of a preparatory treatment device 6 for supplying high density unmelted solder 5 to a gap between a through-hole 3 of the printed wiring board 1 and a lead 4 of a through-hole packaged component 2A, and a solder melting device 7 for melting and hardening the solder 5. COPYRIGHT: (C)2008,JPO&INPIT |
