发明名称 CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
摘要 Connection reliability of a connecting terminal having an immersion gold plating film is improved. A connecting terminal is provided with a conductor layer; an electroless nickel plating film; a first palladium plating film, i.e., an immersion or electroless palladium plating film having a purity of 99 mass% or more; a second palladium plating film, i.e., an electroless palladium plating film having a purity of 90 mass% or higher but not higher than 99 mass%; and an immersion gold plating film. In the connecting terminal, the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the immersion gold plating film are laminated in this order on one side of the conductor layer, and the immersion gold plating layer is positioned as the topmost layer on the side opposite to the conductor layer.
申请公布号 KR20100007920(A) 申请公布日期 2010.01.22
申请号 KR20097024655 申请日期 2008.04.23
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 EJIRI YOSHINORI;HATAKEYAMA SHUICHI;ARIKE SHIGEHARU;HASEGAWA KIYOSHI
分类号 C23C18/52;H01L23/12 主分类号 C23C18/52
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