Mirroring in three-dimensional stacked memory

摘要

A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips. The method also includes forming a second group of memory chips from the plurality of memory chips distinct from the first group of memory chips based on the first ranked list of memory chips. The method also includes pairing a first memory chip from the first group of memory chips and a second memory chip from the second group of memory chips, and mirroring the pairing of memory chips.

主权项

1. A computer program product for three-dimensional (3D)-stacked memory mirroring comprising: a computer readable storage device having a computer readable program stored therein, wherein the computer readable program, when executed on a computing device, causes the computing device to:
receive a plurality of thermal profiles from a plurality of memory chips; rank the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles; form a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips; form a second group of memory chips from the plurality of memory chips distinct from the first group of memory chips based on the first ranked list of memory chips; pair a first memory chip from the first group of memory chips and a second memory chip from the second group of memory chips; and mirror the pair of memory chips.