| 发明名称 | Pattern forming method and pattern forming apparatus | ||
| 摘要 | According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold. | ||
| 申请公布号 | US9403316(B2) | 申请公布日期 | 2016.08.02 |
| 申请号 | US201414311404 | 申请日期 | 2014.06.23 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Yoneda Ikuo |
| 分类号 | B29C59/02;B82Y10/00;B82Y40/00;G03F7/00;B29C59/00;B29L31/34 | 主分类号 | B29C59/02 |
| 代理机构 | Finnegan, Henderson, Farabow, Garrett & Dunner LLP | 代理人 | Finnegan, Henderson, Farabow, Garrett & Dunner LLP |
| 主权项 | 1. A device manufacturing method, comprising: preparing a mold having a pattern formed thereon and a substrate on a surface of which an imprinting material is applied; performing a first shot of imprinting by bringing the mold into contact with the imprinting material on the substrate at a first portion to transfer the pattern thereto, and removing the mold therefrom at a first rate as a mold removal rate; and performing a second shot of imprinting by bringing the mold into contact with the imprinting material on the substrate at a second portion to transfer the pattern thereto, and removing the mold therefrom at a second rate as the mold removal rate, wherein the second portion on the substrate is different from the first portion on the substrate, and the second rate is different from the first rate. | ||
| 地址 | Tokyo JP | ||