| 摘要 |
This heat treatment device is provided with: a heating chamber (2) which heats an object (X) to be treated; and a moisture removal chamber (1) which is provided next to the heating chamber, has the object to be treated transferred thereto from the heating chamber, has the object to be treated transferred therefrom to the heating chamber, and in which the surroundings of the object to be treated are set in a vacuum atmosphere. |
