There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic component by using a conductive polymeric composite or removably securing the first non-metallic component to the one or more non-metallic component by using the conductive polymeric composite, wherein the conductive polymeric composite used in the method comprises a blend of at least one filler material and at least one thermoplastic polymer.
申请公布号
WO2016171623(A1)
申请公布日期
2016.10.27
申请号
WO2016SG50186
申请日期
2016.04.20
申请人
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
发明人
GOH, Kuan Eng Johnson;TAN, Siew Ting Melissa;KWOK, Sen Wai;GOH, Kok Hin Henry