| 发明名称 |
METHOD AND SYSTEM FOR ATTACHMENT OF A HEAT SINK TO A CIRCUIT BOARD |
| 摘要 |
A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller. |
| 申请公布号 |
US2016320813(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201615205319 |
申请日期 |
2016.07.08 |
| 申请人 |
Western Digital Technologies, Inc. |
发明人 |
TAKEUCHI Kevin M.;FAIRCHILD ROBERT G. |
| 分类号 |
G06F1/20;F16B5/02;F16B35/06;H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A computer system comprising:
a heat sink comprising a peripheral portion and a middle portion; a circuit board; a first controller configured to be secured to the circuit board; one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink; and a standoff component comprising:
a first threaded section configured to secure the standoff component to the circuit board; anda second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink, wherein the one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller. |
| 地址 |
Irvine CA US |
