| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a component mounting substrate, which can simply reinforce a junction part between a conductive portion and an electronic component on the substrate and can prevent the electronic component from being peeled off from the junction part due to an environmental change. <P>SOLUTION: The method for manufacturing the component mounting substrate includes: a process A for forming coated films 2 composing conductive portions by applying a polymer type conductive ink to one surface 1a of the substrate 1; a process B for disposing an electronic component 11 on one surface 1a of the substrate 1 so that terminals 12, 12 of the electronic component 11 are abutted on the coated films 2 configuring a pair of electrodes of the conductive portions; and a process C for applying an electric field between the other surface 1b of the substrate 1 and the electronic component 11 and moving conductive particulates included in the coated films 2 to the peripheries of the terminals 12, 12 of the electronic component 11. <P>COPYRIGHT: (C)2010,JPO&INPIT |
