发明名称 ANISOTROPIC CONDUCTIVE SHEET AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an anisotropic conductive sheet capable of improving an adhesion strength onto a circuit board by stabilizing an electrical connection with wiring of the circuit board, and a manufacturing method thereof.SOLUTION: An anisotropic conductive sheet 1 is disposed between the circuit board and a specimen and comprises: a plurality of metal wires 32; an insulation layer 33 in which the plurality of metal wires 32 are penetrated in a thickness direction; and an adhesive layer 34 which is a part of one surface 33a of the insulation layer 33 and has an insulation property and can be adhered to the circuit board. The metal wires 32 are made flush with one surface 33a of the insulation layer 33 or to protrude from the one surface, and made flush with a surface 33b at an opposite side of the one surface 33a of the insulation layer 33 or to protrude from the surface 33b at the opposite side. On the one surface 33a of the insulation layer 33, the adhesive layer 34 is laminated in a non-contact region 44, and the metal wires 32 in the non-contact region 44 are disposed in such a manner that their distal ends are made flush with the one surface 33a of the insulation layer 33 or settled within the adhesive layer 34 over the one surface.SELECTED DRAWING: Figure 3
申请公布号 JP2016207653(A) 申请公布日期 2016.12.08
申请号 JP20160082103 申请日期 2016.04.15
申请人 SHIN ETSU POLYMER CO LTD 发明人 OGINO TSUTOMU
分类号 H01R11/01;G01R1/073;H01B5/16;H01B13/00;H01R43/00 主分类号 H01R11/01
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