| 摘要 |
Provided is an elastic wave device which is not susceptible to breakage upon application of a stress due to heat. An elastic wave device 1, in which an elastic wave element 5 is mounted on a mounting substrate 2 and the elastic wave element 5 is sealed by a sealing resin layer 12. The elastic wave element 5 is bonded to electrode lands 3, 4 of the mounting substrate 2 with use of bumps 10, 11. A surface 12a of the sealing resin layer 12, said surface being on the reverse side of the mounting substrate 2-side surface, is provided with recesses 13a-13d. The ratio of the depth D of the recesses 13a-13d to the height H of the sealing resin layer part from the surface 12a to a second principal surface 6b of a piezoelectric substrate 6, namely D/H is 1/3 or more. |
