ADHESIVE SHEET, DICING TAPE-INTEGRATED ADHESIVE SHEET, FILM, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: an adhesive sheet which can be prevented from being detached from a lead frame in reflow, and which can effectively dissipate heat generated in a chip to the lead frame; a dicing tape-integrated adhesive sheet including such an adhesive sheet; a film; and a semiconductor device and a method for manufacturing a semiconductor device.SOLUTION: An adhesive sheet cured by being kept in a state of being in contact with a copper lead frame at 175°C for 5 hours and subsequently to the curing, kept at 85°C and 85%RH for 24 hours has an adhesive force of 1 MPa or more at 260°C. The adhesive sheet cured by being kept at 120°C for 1 hour and subsequently kept at 175°C for 1 hour has a storage elastic modulus of 10-100 MPa at 260°C, a glass transition temperature of 100°C or less, and a thermal conductivity of 1 W/m K or more after the curing. In addition, the adhesive sheet comprises: an epoxy resin of which the epoxy equivalent is 400 g/eq. or more; and a filler.SELECTED DRAWING: None