| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency circuit module capable of suppressing reduction in design flexibility of a multilayer dielectric substrate.SOLUTION: A high-frequency circuit module comprises: a multilayer dielectric substrate with both principal surfaces on which circuit components are mounted; a plurality of via holes that penetrate between the principal surfaces of the multilayer dielectric substrate to transmit a digital signal; and a plurality of ground wirings arranged so as to collectively surround the plurality of via holes that penetrate between the principal surfaces of the multilayer dielectric substrate.SELECTED DRAWING: Figure 1 |
