METHOD FOR PICKING UP CHIP

摘要

PURPOSE: A method for picking up a chip is provided to separate the chip from a thin film without damage to the chip by applying a lower force in separating the chip from the thin film through a moving adhesion plate. CONSTITUTION: A chip layout board is settled in the table and includes a thin film and chips which are arranged on the thin film. A fixing adhesion plate having a plurality of holes in which the air is inhaled and a moving adsorption plate absorbs the bottom of chip layout board. The adhesive force applied between chip and the thin film to be picked up is decreased. The picking up tool attracts the chip to be picked up. The moving adsorption plate draws one part of the thin film and separates the chip from the thin film.