| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method of sticking a both-sided tape for bonding an electronic component, which can impart stable tension. SOLUTION: This device for sticking an ACF tape 7 for bonding an electronic component to a work comprises a first guide roller 31 which guides a tension imparting unit 8 for imparting constant tension to the ACF tape 7 to maintain a predetermined buffer length, while brought into contact with the separator tape sticking surface side of the led ACF tape 7 and guides it; a second guide which turns around a tape feeding pathway at an acute angle between the first guide roller and a feeding reel 6, and is energized upward by an energizing block 39 while brought into contact with the separator tape sticking surface side; and an upper limit detection sensor 34 for detecting that buffer length becomes the predetermined length. Consequently, since the rollers or the like are not brought into contact with the ACF surface, stable tension is imparted without causing peeling of the ACF. |
