SURFACE ACOUSTIC WAVE DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT DEVICE

摘要

A surface acoustic wave device for realizing a device miniaturization such as area reduction or ridge lowering, a cost reduction, and an improvement in reliability. This surface acoustic wave device comprises a piezoelastic substrate (1), a function region (2) formed of a comb-shaped electrode for exciting surface acoustic waves provided on one main face of the piezoelectric substrate (1), a space forming part (3) provided by covering the function region (2), bump electrodes (4) provided on one face of the piezoelectric substrate (1), and a terminal electrode (5) provided by facing one main face of the piezoelectric substrate (1), wherein the bump electrodes (4) are electrically connected directly to the terminal electrode (5) with the gap between the piezoelectric substrate (1) and the terminal electrode (5) filled with a resin (6). The miniaturization and the increase in reliability of an apparatus are realized by applying such an surface acoustic wave device for a frequency filter or a resonator loaded on a communication apparatus such as a cellular phone or a keyless entry.