| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability to release resistance and blistering property, etc., in reflow and packing property in molding. SOLUTION: This epoxy-based resin composition comprises (A) an epoxy resin, (B) a curing agent and (C) filler. The epoxy-based resin composition is characterized in that a ratio of the filler (C) is 88-96 wt.% based on total resin composition and the epoxy resin comprises (a) a bisphenol F type epoxy resin represented by the chemical formula (I) and a tetramethylbisphenol F type epoxy resin represented by the chemical formula (II).
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