| 摘要 |
PROBLEM TO BE SOLVED: To make preventable both of a flare and dew condensation readily and surely in a photosensitive type semiconductor device. SOLUTION: A semiconductor device 10 has a semiconductor chip 11 with a light receiving element; an open package 12 which fixes the semiconductor chip 11 to a chip holder 12a with a recessed cross section provided on a bottom surface by a fixing material 13; and a fringe 16b which is inserted along an inner side of the package 12, has a window part 16a in a region facing a photosensitive region of the semiconductor chip 11, and has a circumferential edge of the window 16a bent to a bottom surface side. It is constituted of a light screening dehumidifying member 16 having light screening property and moisture absorption property, and a plate-like light transmitting member 18 which is fixed to at least an upper end of the package 12 by a sealing material 17. COPYRIGHT: (C)2005,JPO&NCIPI |
