HEAT DISSIPATING CHASSIS AND HEAT DISSIPATING CASE

摘要

Disclosed are a heat dissipating chassis and a heat dissipating case which are excellent in moldability, thermal conductivity, heat dissipating property and electromagnetic shielding property. The heat dissipating chassis and the heat dissipating case respectively have a thermal conductivity and a heat dissipation rate generally intermediate between those of a metal and those of a general purpose resin. Specifically disclosed is a heat dissipating chassis used for dissipating heat from a heating body or a heat dissipating case used for housing a heating body, which is composed of a heat conductive resin composition containing a thermoplastic resin [A] and a specific heat conductive filler [B]. The blend amount of the heat conductive filler [B] per 100 parts by mass of the thermoplastic resin [A] is 10-1,000 parts by mass.