发明名称 |
IMAGE SENSOR MODULE AND CAMERA MODULE COMPRISING THE SAME |
摘要 |
An image sensor module and a camera module having the same are provided to reduce the height of a camera module by attaching a lens holder to an image sensor module, thereby eliminating a process of re-focusing. An image sensor(103) includes a pixel region part(103a) for changing incident light into an electrical signal. A ceramic substrate(101) includes the first circuit pattern part formed on an upper surface, the second circuit pattern part formed on a lower surface and electrically connected with the image sensor, and a through hole(H) exposing the pixel region part. A coupling part(101a) is protrusively formed at an outer portion of the upper surface of the ceramic substrate. A protrusion(101b) is formed on the lower surface of the ceramic substrate to surround the side of the image sensor. A passive element(102) is electrically connected with the first circuit pattern part.
|
申请公布号 |
KR20080081726(A) |
申请公布日期 |
2008.09.10 |
申请号 |
KR20070022157 |
申请日期 |
2007.03.06 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
CHA, JI BUM;JEONG, HA CHEUN;CHOI, SEY YOUNG |
分类号 |
H04N5/225;G03B17/00;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|