发明名称 IMAGE SENSOR MODULE AND CAMERA MODULE COMPRISING THE SAME
摘要 An image sensor module and a camera module having the same are provided to reduce the height of a camera module by attaching a lens holder to an image sensor module, thereby eliminating a process of re-focusing. An image sensor(103) includes a pixel region part(103a) for changing incident light into an electrical signal. A ceramic substrate(101) includes the first circuit pattern part formed on an upper surface, the second circuit pattern part formed on a lower surface and electrically connected with the image sensor, and a through hole(H) exposing the pixel region part. A coupling part(101a) is protrusively formed at an outer portion of the upper surface of the ceramic substrate. A protrusion(101b) is formed on the lower surface of the ceramic substrate to surround the side of the image sensor. A passive element(102) is electrically connected with the first circuit pattern part.
申请公布号 KR20080081726(A) 申请公布日期 2008.09.10
申请号 KR20070022157 申请日期 2007.03.06
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHA, JI BUM;JEONG, HA CHEUN;CHOI, SEY YOUNG
分类号 H04N5/225;G03B17/00;H01L27/146 主分类号 H04N5/225
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