| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate treating equipment for performing a coating process, a bake process, and a development process for a semiconductor substrate. SOLUTION: A first treating block 100 performs a coating process and a development process. A second treating block is opposed to the first treating block and performs thermal treatment. The first treating block comprises an upper, center, lower unit blocks 110, 150, and 130. The upper and lower unit blocks comprise at least one coating unit for forming a film on a substrate and at least one development unit for developing a photoresist film on the substrate, respectively. The center unit block is arranged detachably between the upper and lower unit blocks and comprises at least one of the coating unit and the development unit. The structure of the center block can be variously changed by the use of a process recipe. This can improve the throughput of the substrate treating equipment. COPYRIGHT: (C)2009,JPO&INPIT |
