发明名称 SUBSTRATE SUCKING SUPPORT MEMBER AND SUBSTRATE SUPPORTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate sucking support member and a substrate supporting method for vacuum-sucking an element forming substrate, capable of preventing the damage of an element provided on the element forming substrate due to vacuum suction of the element forming substrate. SOLUTION: The substrate sucking support member 40 has: a plurality of groove portions 61-63 for vacuum-sucking the element forming substrate 20 provided with a substrate 22 and an element 23 formed on the substrate 22; a plurality of support portions 53-55 provided between the groove portions 61-63 and contacting the element forming substrate 20; and a plurality of through holes 67-69 connected to a vacuum device via a piping 73 for vacuum and used to vacuum the groove portions 61-63. The through holes 67-69 are formed so as to penetrate through the substrate supporting portions 53-55 positioned between one side surfaces 53B, 54B, 55B of the substrate supporting portions 53-55 and the other side surfaces 53C, 54C, 55C of the substrate supporting portions 53-55. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311428(A) 申请公布日期 2008.12.25
申请号 JP20070157803 申请日期 2007.06.14
申请人 MITSUMI ELECTRIC CO LTD 发明人 FUKUDA YUKI
分类号 H01L21/683 主分类号 H01L21/683
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