| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is manufactured by a simpler process, and in which a failure is hardly generated, and also to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device A1 includes: one or more semiconductor elements 2 having an electrode 21 in at least either of a front surface and rear surface; and a protecting member material 3 covering the semiconductor elements 2, wherein a via hole 31 facing the electrode 21 is formed in the protecting member material 3, and a wiring pattern 4 conducting to the electrode 21 is prepared in an inner surface 31a of the via hole 31. <P>COPYRIGHT: (C)2010,JPO&INPIT |
