发明名称 |
Releasing apparatus for separating a semiconductor substrate from a semiconductor template |
摘要 |
According to one embodiment, a releasing apparatus for separating a semiconductor substrate from a semiconductor template, the releasing apparatus having an enclosed pressure chamber having at least one gas inlet and at least one gas outlet. A top vacuum chuck for securing a released semiconductor substrate or semiconductor template in the enclosed pressure chamber. A bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in the enclosed pressure chamber. A gap between the attached semiconductor substrate and semiconductor template and the top vacuum chuck allowing gas flowing through the gap to generate lifting forces on the attached semiconductor substrate and semiconductor template. |
申请公布号 |
US9397250(B2) |
申请公布日期 |
2016.07.19 |
申请号 |
US201213463757 |
申请日期 |
2012.05.03 |
申请人 |
Solexel, Inc. |
发明人 |
Moslehi Mehrdad M.;Wang David Xuan-Qi;Tor Sam Tone;Kramer Karl-Josef |
分类号 |
H01L21/20;H01L31/18;H01L21/67;H01L21/683;H01L21/762 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
Wood John |
主权项 |
1. A releasing apparatus for separating a semiconductor substrate from a semiconductor template, comprising:
an enclosed pressure chamber having at least one gas inlet and at least one gas outlet; a top vacuum chuck for securing a released semiconductor substrate or semiconductor template in said enclosed pressure chamber; a bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in said enclosed pressure chamber; and a gap between said attached semiconductor substrate and semiconductor template and said top vacuum chuck allowing gas flowing through said gap to generate lifting forces on said attached semiconductor substrate and semiconductor template. |
地址 |
Milpitas CA US |