发明名称 Semiconductor device
摘要 A semiconductor device according to the present invention has a MIS structure that includes a semiconductor layer, a gate insulating film in contact with the semiconductor layer, and a gate electrode formed on the gate insulating film, and the gate insulating film includes an AlON layer with a nitrogen composition of 5% to 40%. A semiconductor device is thereby provided with which electron trapping in the gate insulating film can be reduced and shifting of a threshold voltage Vth can be suppressed.
申请公布号 US9397185(B2) 申请公布日期 2016.07.19
申请号 US201314649149 申请日期 2013.12.02
申请人 ROHM CO., LTD. 发明人 Watanabe Heiji;Hosoi Takuji;Shimura Takayoshi;Nakamura Ryota;Nakano Yuki;Mitani Shuhei;Nakamura Takashi;Asahara Hirokazu
分类号 H01L29/51;H01L29/78;H01L29/49;H01L29/423;H01L29/16;H01L29/20;H01L29/417 主分类号 H01L29/51
代理机构 Hamre, Schumann, Mueller & Larson, P.C. 代理人 Hamre, Schumann, Mueller & Larson, P.C.
主权项 1. A semiconductor device comprising an MIS structure that includes: a semiconductor layer including a first conductivity type drain region, a second conductivity type body region and a first conductivity type source region; a source trench penetrating through the source region and the body region from a front surface of the semiconductor layer such that the source trench reaches the drain region; a gate insulating film in contact with the semiconductor layer; and a gate electrode formed on the gate insulating film such that the gate electrode faces the body region across the gate insulating film; wherein the gate insulating film includes an AlON layer with a nitrogen composition of 5% to 40%.
地址 Kyoto JP