发明名称 Semiconductor device having metal gate and manufacturing method thereof
摘要 A semiconductor device having metal gate includes a substrate, a metal gate positioned on the substrate, a high-k gate dielectric layer, and an epitaxial channel layer positioned in between the high-k gate dielectric layer and the substrate. A length of the epitaxial channel layer is larger than a length of the metal gate, and a bottom of the epitaxial channel layer and the substrate are coplanar.
申请公布号 US9397184(B2) 申请公布日期 2016.07.19
申请号 US201514838371 申请日期 2015.08.28
申请人 UNITED MICROELECTRONICS CORP. 发明人 Hou Yong Tian
分类号 H01L29/49;H01L29/66;H01L29/78;H01L21/8238;H01L29/16;H01L29/20;H01L29/423;H01L29/51 主分类号 H01L29/49
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A semiconductor device having metal gate, comprising: a substrate; a metal gate positioned on the substrate; a high-k gate dielectric layer; a plurality of lightly doped drains (LDDs) disposed in the substrate, wherein a top surface of the LDDs is the same as a top surface of the substrate; and an epitaxial channel layer positioned in between the high-k gate dielectric layer and the substrate, a length of the epitaxial channel layer being larger than a length of the metal gate, wherein a bottom surface of the epitaxial channel layer and the top surfaces of the substrate both inside the semiconductor device and outside the semiconductor device are coplanar, respectively.
地址 Science-Based Industrial Park, Hsin-Chu TW