发明名称 |
Semiconductor device having metal gate and manufacturing method thereof |
摘要 |
A semiconductor device having metal gate includes a substrate, a metal gate positioned on the substrate, a high-k gate dielectric layer, and an epitaxial channel layer positioned in between the high-k gate dielectric layer and the substrate. A length of the epitaxial channel layer is larger than a length of the metal gate, and a bottom of the epitaxial channel layer and the substrate are coplanar. |
申请公布号 |
US9397184(B2) |
申请公布日期 |
2016.07.19 |
申请号 |
US201514838371 |
申请日期 |
2015.08.28 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Hou Yong Tian |
分类号 |
H01L29/49;H01L29/66;H01L29/78;H01L21/8238;H01L29/16;H01L29/20;H01L29/423;H01L29/51 |
主分类号 |
H01L29/49 |
代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
主权项 |
1. A semiconductor device having metal gate, comprising:
a substrate; a metal gate positioned on the substrate; a high-k gate dielectric layer; a plurality of lightly doped drains (LDDs) disposed in the substrate, wherein a top surface of the LDDs is the same as a top surface of the substrate; and an epitaxial channel layer positioned in between the high-k gate dielectric layer and the substrate, a length of the epitaxial channel layer being larger than a length of the metal gate, wherein a bottom surface of the epitaxial channel layer and the top surfaces of the substrate both inside the semiconductor device and outside the semiconductor device are coplanar, respectively. |
地址 |
Science-Based Industrial Park, Hsin-Chu TW |