Solid-state imaging device, members for the same, and imaging system

摘要

The present invention provides a solid-state imaging device including a pad capable of reducing inferior connection with an external terminal. The solid-state imaging device includes a first substrate provided, on its front face, with photoelectric conversion elements, a first wiring structure, a second substrate provided, on its front face, with at least a part of peripheral circuits, and a second wiring structure. The first substrate, the first wiring structure, the second wiring structure, and the second substrate are provided in this order. The first wiring structure includes a wiring layer including wirings made mainly of copper. The second wiring structure includes a wiring layer including wirings made mainly of copper. Wirings made mainly of copper in the first wiring structure are bonded with wirings made mainly of copper in the second wiring structure. The solid-state imaging device includes a pad formed of a conductive element made mainly of aluminum.

主权项

1. A device comprising:
a first substrate provided with a first transistor, the first substrate having a first face where the first transistor is provided and having a second face on the opposite side of the first face of the first substrate; a first wiring structure provided on the first face of the first substrate, the first wiring structure having a first wiring layer; a second substrate provided with a second transistor, the second substrate having a first face where the second transistor is provided and having a second face on the opposite side of the first face of the second substrate; and a second wiring structure provided on the first face of the second substrate, the second wiring structure having a second wiring layer; and a pad for connection with an external terminal, wherein the second wiring structure is arranged between the first substrate and the second substrate, wherein the first wiring layer includes a first wiring made mainly of copper, the second wiring layer includes a second wiring made mainly of copper, and the pad includes a conductive element made mainly of aluminum, and wherein a distance between the pad and the second face of the second substrate is larger than a thickness (D2) of the second substrate, and is smaller than a distance between the second face of the first substrate and the second face of the second substrate.