| 发明名称 | Printed wiring board and method for manufacturing printed wiring board | ||
| 摘要 | A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions. | ||
| 申请公布号 | US9451711(B2) | 申请公布日期 | 2016.09.20 |
| 申请号 | US201414169314 | 申请日期 | 2014.01.31 |
| 申请人 | IBIDEN CO., LTD. | 发明人 | Hibino Toshiaki |
| 分类号 | H05K1/03;H05K3/42;H05K3/00;H05K3/46;H05K3/10 | 主分类号 | H05K1/03 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A printed wiring board, comprising: an insulating substrate having a penetrating hole formed through the insulating substrate; a first conductive pattern formed on a first surface of the insulating substrate; a second conductive pattern formed on a second surface of the insulating substrate on an opposite side with respect to the first surface of the insulating substrate; and a through-hole conductor formed in the penetrating hole in the insulating substrate such that the through-hole conductor is connecting the first conductive pattern on the first surface of the insulating substrate and the second conductive pattern on the second surface of the insulating substrate, wherein the penetrating hole has a first opening portion opening on the first surface of the insulating substrate, a second opening portion opening on the second surface of the insulating substrate and a third opening portion connecting the first opening portion and the second opening portion, the third opening portion has the maximum diameter which is greater than the minimum diameter of the first opening portion and the minimum diameter of the second opening portion, and the insulating substrate comprises a resin material and a plurality of sheets each comprising a reinforcement material. | ||
| 地址 | Ogaki JP | ||