发明名称 |
Power semiconductor package with a common conductive clip |
摘要 |
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to a common conductive clip, and a control gate for being driven by a driver IC. The stacked half-bridge package also includes a sync transistor having a sync drain for connection to the common conductive clip, a sync source coupled to a low voltage input, and a sync gate for being driven by the driver IC. The control and sync transistors are stacked on opposite sides of the common conductive clip with the common conductive clip electrically and mechanically coupling the control source with the sync drain, where the common conductive clip has a conductive leg for providing electrical and mechanical connection to an output terminal leadframe. |
申请公布号 |
US9461022(B2) |
申请公布日期 |
2016.10.04 |
申请号 |
US201514722974 |
申请日期 |
2015.05.27 |
申请人 |
Infineon Technologies Americas Corp. |
发明人 |
Cho Eung San;Cheah Chuan;Sawle Andrew N. |
分类号 |
H01L23/495;H01L25/07;H01L23/00;H01L23/492 |
主分类号 |
H01L23/495 |
代理机构 |
Shumaker & Sieffert, P.A. |
代理人 |
Shumaker & Sieffert, P.A. |
主权项 |
1. A power semiconductor package comprising:
a control transistor having a control drain for connection to a high voltage input, a control source coupled to a common conductive clip, and a control gate; a sync transistor having a sync drain for connection to said common conductive clip, a sync source coupled to a low voltage input, and a sync gate; said control and sync transistors being situated on opposite sides of said common conductive clip, said common conductive clip coupling said control source with said sync drain. |
地址 |
El Segundo CA US |