Systems, apparatus, and methods for heat dissipation

摘要

Some examples of the disclosure include a semiconductor package having a heat spreader, an outer perimeter portion attached to the bottom of the heat spreader along the perimeter and having a plurality of electrical pathways, a package substrate located below and spaced from the outer perimeter portion and having a plurality of electrical pathways, a plurality of connection points located between the outer perimeter component and the package substrate to provide connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways in the package substrate, and a cavity formed on the bottom of the heat spreader inside the outer perimeter portion.

主权项

1. A semiconductor package, comprising:
a heat spreader having a bottom side and a perimeter; an outer perimeter portion attached to the bottom side of the heat spreader along the perimeter of the heat spreader, the outer perimeter portion having a plurality of electrical pathways therein; a package substrate located below and spaced from the outer perimeter portion, the package substrate having a plurality of electrical pathways therein; a plurality of connection points located between the outer perimeter portion and the package substrate, the plurality of connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways of the package substrate; and wherein the outer perimeter portion forms a cavity on the bottom side of the heat spreader.