发明名称 CYCLIC DEPOSITION METHOD FOR THIN FILM AND MANUFACTURING METHOD FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
摘要 Provided is a method of cyclically depositing a thin film including: performing an oxide depositing operation of repeatedly performing a deposition operation, a first purge operation, a reaction operation, and a second purge operation, wherein the deposition operation deposits silicon on a target by injecting a silicon precursor into a chamber into which the target is loaded, the first purge operation removes a non-reacted silicon precursor and a reacted byproduct from inside the chamber, the reaction operation supplies a first reaction source including oxygen into the chamber to form the deposited silicon as an oxide including silicon, and the second purge operation removes a non-reacted first reaction source and a reacted byproduct from the inside of the chamber; and performing a plasma processing operation of supplying plasma made of a second reaction source including nitrogen to the inside of the chamber to process the oxide including the silicon.
申请公布号 US2016300723(A1) 申请公布日期 2016.10.13
申请号 US201414915919 申请日期 2014.09.23
申请人 EUGENE TECHNOLOGYCO., LTD. 发明人 KIM Hai-Won;KIM Seok-Yun
分类号 H01L21/28;H01L29/423;H01L29/792;H01L29/66;H01L21/02;H01L29/51 主分类号 H01L21/28
代理机构 代理人
主权项 1. A method of cyclically depositing a thin film, the method comprising: performing an oxide depositing operation of repeatedly performing a deposition operation, a first purge operation, a reaction operation, and a second purge operation, wherein the deposition operation deposits silicon on a target by injecting a silicon precursor into a chamber into which the target is loaded, the first purge operation removes a non-reacted silicon precursor and a reacted byproduct from inside the chamber, the reaction operation supplies a first reaction source comprising oxygen into the chamber to form the deposited silicon as an oxide comprising silicon, and the second purge operation removes a non-reacted first reaction source and a reacted byproduct from the inside of the chamber; and performing a plasma processing operation of supplying plasma made of a second reaction source including nitrogen to the inside of the chamber to process the oxide comprising the silicon.
地址 Gyeonggi-do KR